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Heatsink

  • JEDEC standard 1.35V and 1.5V Power Supply
  • VDDQ = 1.35V and 1.5V
  • 800MT/s fCK for 1600Mb/sec/pin
  • 8 independent internal bank
  • Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5
  • Programmable Additive Latency: 0, CL – 2, or CL – 1 clock
  • 8-bit pre-fetch
  • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
  • Bi-directional Differential Data Strobe
  • Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
  • On Die Termination using ODT pin
  • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE ≤ 95°C
  • Asynchronous Reset
  • PCB: Height1.18” (30mm), double sided component
  • Lead Free RoHS Compliant
43.73
  • Improved stability for overclocking
  • Increased efficiency
  • Intel® XMP 3.0 certified
  • AMD EXPO certified
  • Qualified by the world’s leading motherboard manufacturers*
  • Low-profile heat spreader design in black or white
1,141.25
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Dual-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • 16 internal banks; 4 groups of 4 banks each
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
311.46
  • PC/Server 32 GB DDR5 Dual-channel
  • 288-pin DIMM 2 x 16 GB
  • CAS latency: 39
  • 1.1,1.4 V
  • Backlight Various
  • Intel Extreme Memory Profile (XMP) 3.0
709.39
  • PC/Server 32 GB DDR5 Dual-channel
  • 288-pin DIMM 2 x 16 GB
  • 1.4 V
  • Backlight Multicolour
  • Intel Extreme Memory Profile (XMP) 3.0
671.93
  • 2 x 16 GB RAM
  • Cas Latency 36
  • DDR5
  • 6000 MHz clock speed
600.63
  • Improved stability for overclocking
  • Increased efficiency
  • Intel® XMP 3.0 certified
  • AMD EXPO certified
  • Qualified by the world’s leading motherboard manufacturers*
  • Low-profile heat spreader design in black or white
1,463.74
  • Improved stability for overclocking
  • Increased efficiency
  • Intel® XMP 3.0 certified
  • AMD EXPO certified
  • Qualified by the world’s leading motherboard manufacturers*
  • Low-profile heat spreader design in black or white
735.17
  • PC/Server 32 GB DDR5 Dual-channel
  • 288-pin DIMM 2 x 16 GB
  • CAS latency: 36
  • 1.1,1.35 V
  • Backlight Various
  • Intel Extreme Memory Profile (XMP) 3.0
586.24
  • PC/Server 32 GB DDR5 Dual-channel
  • 288-pin DIMM 2 x 16 GB
  • CAS latency: 30
  • 1.35 V
  • Backlight Multicolour
  • AMD Extended Profiles for Overclocking (EXPO) 1.0
689.32
  • PC/Server 32 GB DDR5 Dual-channel
  • 288-pin DIMM 2 x 16 GB
  • CAS latency: 36
  • 1.35 V
  • Backlight Multicolour
  • AMD Extended Profiles for Overclocking (EXPO) 1.0

580.23
  • PC/Server 32 GB DDR5 Dual-channel
  • 288-pin DIMM 2 x 16 GB
  • CAS latency: 30
  • 1.35 V
  • AMD Extended Profiles for Overclocking (EXPO) 1.0
615.88

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