Free International Shipping. No Minimum Purchase Required*

How to find us  |  Gift vouchers

All RAM

Filters

By Brand

Type of RAM


Module Type


Memory Capacity


Number of Modules


Overclocking

Memory Composition

Features

Heatsink

  • Make everything on your computer faster
  • Multitask with ease
  • Easy to install
  • Maximize the value of your system
91.93
kingston technology fury impact memory module
  • Powerful SODIMM performance
  • Plug N Play automatic overclocking functionality*
  • Intel XMP-ready profiles
  • Ready for AMD Ryzen
  • Higher performance with low power consumption
  • Slim form, sleek design
553.35
  • Powerful SODIMM performance
  • Plug N Play automatic overclocking functionality*
  • Intel XMP-ready profiles
  • Ready for AMD Ryzen
  • Higher performance with low power consumption
  • Slim form, sleek design
355.73
  • Laptop 32 GB DDR4 Single-channel
  • 260-pin SO-DIMM 1 x 32 GB
  • CAS latency: 22
  • 1.2 V

321.13
  • Laptop 16 GB DDR4 3200 MT/s
  • 260-pin SO-DIMM 1 x 16 GB
  • CAS latency: 22
  • 1.2 V
212.42
  • Make everything on your computer faster
  • Multitask with ease
  • Easy to install
  • Maximize the value of your system
189.04
  • Make everything on your computer faster
  • Multitask with ease
  • Easy to install
  • Maximize the value of your system
207.95
  • Laptop 16 GB DDR4
  • 2 x 8 GB
  • CAS latency: 22
  • 1.2 V
  • Intel Extreme Memory Profile (XMP) 2.0
168.68
  • 8 GB DDR4
  • 1 x 8 GB
  • CAS latency: 19
  • 1.2 V
67.83
  • JEDEC standard 1.35V and 1.5V Power Supply
  • VDDQ = 1.35V and 1.5V
  • 800MT/s fCK for 1600Mb/sec/pin
  • 8 independent internal bank
  • Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5
  • Programmable Additive Latency: 0, CL – 2, or CL – 1 clock
  • 8-bit pre-fetch
  • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
  • Bi-directional Differential Data Strobe
  • Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
  • On Die Termination using ODT pin
  • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
  • Asynchronous Reset
  • PCB: Height 1.18” (30mm), double sided component
76.58
  • Laptop 8 GB DDR3L
  • 1 x 8 GB
  • CAS latency: 11
  • 1.35 V

28.56
  • JEDEC standard 1.35V and 1.5V Power Supply
  • VDDQ = 1.35V and 1.5V
  • 800MT/s fCK for 1600Mb/sec/pin
  • 8 independent internal bank
  • Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5
  • Programmable Additive Latency: 0, CL – 2, or CL – 1 clock
  • 8-bit pre-fetch
  • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
  • Bi-directional Differential Data Strobe
  • Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
  • On Die Termination using ODT pin
  • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE ≤ 95°C
  • Asynchronous Reset
  • PCB: Height1.18” (30mm), double sided component
  • Lead Free RoHS Compliant
40.16