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Heatsink

  • Power Supply: VDD = 1.2V Typical
  • VDDQ = 1.2V Typical
  • VPP = 2.5V Typical
  • VDDSPD = 2.2V to 3.6V
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Single-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • 8 internal banks; 2 groups of 4 banks each
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
  • PCB: Height 1.23” (31.25mm)
  • RoHS Compliant and Halogen-Free
44.45
  • PC/Server 16 GB DDR4
  • 288-pin DIMM 1 x 16 GB
  • CAS latency: 19
  • 1.2 V

137.45
  • PC/Server 8 GB DDR3
  • 1 x 8 GB
  • CAS latency: 11
28.56