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Heatsink

  • Cost-efficient, high-performance DDR4 upgrade
  • Intel® XMP Ready and XMP Certified
  • Speeds of up to 3600MT/s and kit capacity of up to 128GB
  • Ready for AMD Ryzen™
  • Low-profile heat spreader design
371.38
  • Cost-efficient, high-performance DDR4 upgrade
  • Intel® XMP Ready and XMP Certified
  • Speeds of up to 3600MT/s and kit capacity of up to 128GB
  • Ready for AMD Ryzen™
  • Low-profile heat spreader design
323.95
  • PC/Server 32 GB DDR4 Single-channel
  • 288-pin DIMM 1 x 32 GB
  • CAS latency: 22
  • 1.2 V
323.72
  • PC/Server 16 GB DDR4 Dual-channel
  • 288-pin DIMM 2 x 8 GB
  • CAS latency: 16
  • 1.35 V
  • Intel Extreme Memory Profile (XMP)
191.89
  • PC/Server 16 GB DDR4
  • 2 x 8 GB
  • CAS latency: 16
  • 1.35,1.2 V

176.72
  • Power Supply: VDD = 1.2V Typical
  • VDDQ = 1.2V Typical
  • VPP = 2.5V Typical
  • VDDSPD = 2.2V to 3.6V
  • Nominal and dynamic on-die termination (ODT) for
  • data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Single-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • 16 internal banks; 4 groups of 4 banks each
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8
  • via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
  • PCB: Height 1.18” (30.00mm)
  • RoHS Compliant and Halogen-Free
180.11
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Dual-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • 16 internal banks; 4 groups of 4 banks each
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
  • RoHS Compliant and Halogen-Free
190.10
  • Cost-efficient, high-performance DDR4 upgrade
  • Intel® XMP Ready and XMP Certified
  • Speeds of up to 3600MT/s and kit capacity of up to 128GB
  • Ready for AMD Ryzen™
  • Low-profile heat spreader design
216.88
  • Cost-efficient, high-performance DDR4 upgrade
  • Intel® XMP Ready and XMP Certified
  • Speeds of up to 3600MT/s and kit capacity of up to 128GB
  • Ready for AMD Ryzen™
  • Low-profile heat spreader design
190.82
  • 16 GB DDR4
  • 1 x 16 GB
  • CAS latency: 22
  • 1.2 V
155.12
  • 16 GB DDR4
  • 1 x 16 GB
  • CAS latency: 16
  • 1.35 V
158.69
  • PC/Server 16 GB DDR4 Single-channel
  • 288-pin DIMM 1 x 16 GB
  • CAS latency: 16
  • 1.35 V
  • Intel Extreme Memory Profile (XMP) 2.0
158.69