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Kingston Technology ValueRAM memory module
Kingston Technology ValueRAM memory module - Image 2

Kingston Technology ValueRAM memory module

  • JEDEC standard 1.35V and 1.5V Power Supply
  • VDDQ = 1.35V and 1.5V
  • 800MT/s fCK for 1600Mb/sec/pin
  • 8 independent internal bank
  • Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5
  • Programmable Additive Latency: 0, CL – 2, or CL – 1 clock
  • 8-bit pre-fetch
  • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
  • Bi-directional Differential Data Strobe
  • Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
  • On Die Termination using ODT pin
  • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE ≤ 95°C
  • Asynchronous Reset
  • PCB: Height1.18” (30mm), double sided component
  • Lead Free RoHS Compliant

€40.16

Product information

  • JEDEC standard 1.35V and 1.5V Power Supply
  • VDDQ = 1.35V and 1.5V
  • 800MT/s fCK for 1600Mb/sec/pin
  • 8 independent internal bank
  • Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5
  • Programmable Additive Latency: 0, CL – 2, or CL – 1 clock
  • 8-bit pre-fetch
  • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
  • Bi-directional Differential Data Strobe
  • Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
  • On Die Termination using ODT pin
  • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE ≤ 95°C
  • Asynchronous Reset
  • PCB: Height1.18” (30mm), double sided component
  • Lead Free RoHS Compliant

Product Specifications

Features
Buffered memory type
Unregistered (unbuffered)
CAS latency
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
11
Internal memory
A computer's memory which is directly accessible to the CPU.
4 GB
Memory layout (modules x size)
How the overall memory of the product is put together, defined by the number of modules and the size.
1 x 4 GB
Internal memory type
The type of internal memory such as RAM, GDDR5.
DDR3L
Memory data transfer rate
1600 MT/s
Component for
What this product is used as a part of (component for).
Laptop
Memory form factor
Design of the memory e.g. 240-pin DIMM, SO-DIMM.
204-pin SO-DIMM
ECC
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory bus
Hardware and software that connects the main memory to the memory controller in computer systems. Originally, general-purpose buses like VMEbus and the S-100 bus were used, but to reduce latency, modern memory buses are designed to connect directly to DRAM chips, and thus are designed by chip standards bodies such as JEDEC.
64 bit
Memory voltage
The voltage (V) of the memory in the device.
1.35, 1.5 V
Module configuration
512M X 64
Row cycle time
48.125 ns
Refresh row cycle time
260 ns
Row active time
35 ns
Features
Country of origin
Country where the device is made. Aka Country of manufacture (COM).
Taiwan
Lead plating
Gold
Operational conditions
Operating temperature (T-T)
The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 °C
Storage temperature (T-T)
The minimum and maximum temperatures at which the product can be safely stored.
-55 - 100 °C
Weight & dimensions
Width
The measurement or extent of something from side to side.
67.6 mm
Height
The measurement of the product from head to foot or from base to top.
30 mm
Logistics data
Harmonized System (HS) code
84733020
Other features
Chips organisation
X8
Bus clock rate
1600 MHz
Error indication
Memory layout
Describes how memory is plugged on the motherboard
1 x 4096 MB
Internal memory
The amount of memory, usually measured in bytes (e.g. MB, GB), which is installed in the system's hardware.
4096 MB

Features
Buffered memory type
Unregistered (unbuffered)
CAS latency
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module’s output pins. In general, the lower the CAS latency, the better.
11
Internal memory
A computer’s memory which is directly accessible to the CPU.
4 GB
Memory layout (modules x size)
How the overall memory of the product is put together, defined by the number of modules and the size.
1 x 4 GB
Internal memory type
The type of internal memory such as RAM, GDDR5.
DDR3L
Memory data transfer rate
1600 MT/s
Component for
What this product is used as a part of (component for).
Laptop
Memory form factor
Design of the memory e.g. 240-pin DIMM, SO-DIMM.
204-pin SO-DIMM
ECC
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory bus
Hardware and software that connects the main memory to the memory controller in computer systems. Originally, general-purpose buses like VMEbus and the S-100 bus were used, but to reduce latency, modern memory buses are designed to connect directly to DRAM chips, and thus are designed by chip standards bodies such as JEDEC.
64 bit
Memory voltage
The voltage (V) of the memory in the device.
1.35, 1.5 V
Module configuration
512M X 64
Row cycle time
48.125 ns
Refresh row cycle time
260 ns
Row active time
35 ns
Features
Country of origin
Country where the device is made. Aka Country of manufacture (COM).
Taiwan
Lead plating
Gold
Operational conditions
Operating temperature (T-T)
The minimum and maximum temperatures at which the product can be safely operated.
0 – 85 °C
Storage temperature (T-T)
The minimum and maximum temperatures at which the product can be safely stored.
-55 – 100 °C
Weight & dimensions
Width
The measurement or extent of something from side to side.
67.6 mm
Height
The measurement of the product from head to foot or from base to top.
30 mm
Logistics data
Harmonized System (HS) code
84733020
Other features
Chips organisation
X8
Bus clock rate
1600 MHz
Error indication
Memory layout
Describes how memory is plugged on the motherboard
1 x 4096 MB
Internal memory
The amount of memory, usually measured in bytes (e.g. MB, GB), which is installed in the system’s hardware.
4096 MB

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Delivery & Returns

We aim to deliver your order quickly and safely.

  • Standard delivery: 3–6 working days within Ireland.

  • Click & Collect: Available free from our Clonakilty store (you will be notified when your order is ready).

  • If an item is out of stock, we will contact you with an updated delivery timeframe or alternative options.

  • Delivery charges are calculated at checkout based on order size and destination.

Warranty

All products sold by Computronic come with a standard manufacturer’s warranty. Warranty length and coverage may vary by product and brand. For most electronics, this is 12 months from the date of purchase. Please keep your receipt or order confirmation as proof of purchase.

  • Warranty covers manufacturing defects and hardware faults.

  • It does not cover accidental damage, misuse, or normal wear and tear.

  • For warranty claims, please contact us or bring the product to our Clonakilty store.

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