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Kingston Technology FURY Impact memory module
Kingston Technology FURY Impact memory module - Image 2
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Kingston Technology FURY Impact memory module

  • Mighty DDR5 SODIMM performance
  • Plug N Play automatic overclocking functionality**
  • Intel® XMP 3.0 Certified
  • Low power consumption, increased efficiency
  • Improved stability with on-die ECC

€812.49

Product information

  • Mighty DDR5 SODIMM performance
  • Plug N Play automatic overclocking functionality**
  • Intel® XMP 3.0 Certified
  • Low power consumption, increased efficiency
  • Improved stability with on-die ECC

Product Specifications

Specs

Features
Buffered memory type
Unregistered (unbuffered)
On-Die ECC
CAS latency
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
40
Internal memory
A computer's memory which is directly accessible to the CPU.
64 GB
Memory layout (modules x size)
How the overall memory of the product is put together, defined by the number of modules and the size.
2 x 32 GB
Internal memory type
The type of internal memory such as RAM, GDDR5.
DDR5
Memory data transfer rate
5600 MT/s
Component for
What this product is used as a part of (component for).
Laptop
Memory form factor
Design of the memory e.g. 240-pin DIMM, SO-DIMM.
262-pin SO-DIMM
ECC
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory ranking
2
Memory voltage
The voltage (V) of the memory in the device.
1.1 V
Module configuration
4096M x 64
Row cycle time
48 ns
Refresh row cycle time
295 ns
Row active time
28.56 ns
Intel Extreme Memory Profile (XMP)
Intel Extreme Memory Profile (XMP) version
3.0
SPD profile
Programming power voltage (VPP)
1.8 V
Country of origin
Country where the device is made. Aka Country of manufacture (COM).
China, Taiwan
Features
Cooling type
The method used to cool the device or to cool the air around the device.
Heatsink
Lead plating
Gold
JEDEC standard
Operational conditions
Operating temperature (T-T)
The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 °C
Storage temperature (T-T)
The minimum and maximum temperatures at which the product can be safely stored.
-55 - 100 °C
Weight & dimensions
Width
The measurement or extent of something from side to side.
3.8 mm
Depth
The distance from the front to the back of something.
69.6 mm
Height
The measurement of the product from head to foot or from base to top.
30 mm
Weight
Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
20 g
Packaging data
Package width
The distance from one side of the packaging to the other.
95.2 mm
Package depth
The distance from the front to the back of the packaging.
14 mm
Package height
The distance from the top to the bottom of the packaging.
171.4 mm
Package weight
Weight of the packaged product.
46.21 g
Logistics data
Master (outer) case width
203.2 mm
Master (outer) case length
311.1 mm
Master (outer) case height
101.6 mm
Master (outer) case gross weight
1.37 kg
Products per master (outer) case
25 pc(s)

Specs

Features
Buffered memory type
Unregistered (unbuffered)
On-Die ECC
CAS latency
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module’s output pins. In general, the lower the CAS latency, the better.
40
Internal memory
A computer’s memory which is directly accessible to the CPU.
64 GB
Memory layout (modules x size)
How the overall memory of the product is put together, defined by the number of modules and the size.
2 x 32 GB
Internal memory type
The type of internal memory such as RAM, GDDR5.
DDR5
Memory data transfer rate
5600 MT/s
Component for
What this product is used as a part of (component for).
Laptop
Memory form factor
Design of the memory e.g. 240-pin DIMM, SO-DIMM.
262-pin SO-DIMM
ECC
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory ranking
2
Memory voltage
The voltage (V) of the memory in the device.
1.1 V
Module configuration
4096M x 64
Row cycle time
48 ns
Refresh row cycle time
295 ns
Row active time
28.56 ns
Intel Extreme Memory Profile (XMP)
Intel Extreme Memory Profile (XMP) version
3.0
SPD profile
Programming power voltage (VPP)
1.8 V
Country of origin
Country where the device is made. Aka Country of manufacture (COM).
China, Taiwan
Features
Cooling type
The method used to cool the device or to cool the air around the device.
Heatsink
Lead plating
Gold
JEDEC standard
Operational conditions
Operating temperature (T-T)
The minimum and maximum temperatures at which the product can be safely operated.
0 – 85 °C
Storage temperature (T-T)
The minimum and maximum temperatures at which the product can be safely stored.
-55 – 100 °C
Weight & dimensions
Width
The measurement or extent of something from side to side.
3.8 mm
Depth
The distance from the front to the back of something.
69.6 mm
Height
The measurement of the product from head to foot or from base to top.
30 mm
Weight
Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
20 g
Packaging data
Package width
The distance from one side of the packaging to the other.
95.2 mm
Package depth
The distance from the front to the back of the packaging.
14 mm
Package height
The distance from the top to the bottom of the packaging.
171.4 mm
Package weight
Weight of the packaged product.
46.21 g
Logistics data
Master (outer) case width
203.2 mm
Master (outer) case length
311.1 mm
Master (outer) case height
101.6 mm
Master (outer) case gross weight
1.37 kg
Products per master (outer) case
25 pc(s)

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Delivery & Returns

We aim to deliver your order quickly and safely.

  • Standard delivery: 3–6 working days within Ireland.

  • Click & Collect: Available free from our Clonakilty store (you will be notified when your order is ready).

  • If an item is out of stock, we will contact you with an updated delivery timeframe or alternative options.

  • Delivery charges are calculated at checkout based on order size and destination.

Warranty

All products sold by Computronic come with a standard manufacturer’s warranty. Warranty length and coverage may vary by product and brand. For most electronics, this is 12 months from the date of purchase. Please keep your receipt or order confirmation as proof of purchase.

  • Warranty covers manufacturing defects and hardware faults.

  • It does not cover accidental damage, misuse, or normal wear and tear.

  • For warranty claims, please contact us or bring the product to our Clonakilty store.

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